Mobile Phone Cooling Plate Heat Sink Expend Coolin

Product details of Mobile Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling fans Game Cooler Cell Phone

[Mobile phone composite even heat plate] fast cooling uniform heat dissipation, increase the heat dissipation area, accelerate the speed of heat dissipation.

[Semiconductor cooling & large area heat sink] for cell phone hot spots, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat dissipation effect.

[Strong adhesive – not fall off] strong adhesive, firmly adsorbed, no need to worry about radiator fall.

[Thin and light experience] The thickness is only 1mm, closely fit the phone.

[With silicone protection, do not hurt the phone] easy to take and easy to paste, with silicone protection, soft and do not hurt the machine.

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